2019 4th International Symposium on Materials Science and Engineering
Aug. 14-16, 2019, Nanjing, China
中文版 More Conferences
Days to the Submission Deadline
Important Dates
SubmissionJul. 8, 2019
Notification20-40 days after the submission
Publication30-60 days after the final edition
ConferenceAug. 14-16, 2019
MSCIENG2019 News
MSCIENG2019 Call for Papers【Sep. 20, 2018】

2019 4th International Symposium on Materials Science and Engineering (MSCIENG2019) invites original and unpublished papers. The papers may include but are not limited to:

Electronic Materials: Semiconductor Materials, Display Materials, Battery Materials, Optical Materials, Dielectric Materials, Ferroelectric Materials, Conductive Metal.

Structural Materials: Wrought Iron, Cast Iron, Steel, Stainless Steel, Reinforced Concrete, Prestressed Concrete, Aluminum, Composites, Masonry, Timber.

Materials Chemistry: Classical Analytical Chemistry, Instrumental Analysis, Optical Analysis, Polymer Science, Material Processing, Structural Chemistry, Material Shaping.

Materials Processing Engineering: Metallurgy Technology, Polymer Materials, Polymer Processing, Metalworking, Casting, Welding.

If you have any interest, please submit your paper via the submission system:http://www.papersubmission.net

MSCIENG2018 Was Successfully Held During Jul. 25-27, 2018 in Chengdu, China【Sep. 20, 2018】

MSCIENG2018 has been successfully held during Jul. 25-27, 2018 at Crowne Plaza Chengdu City Centre. Scholars and researchers from related research fields at home and abroad have participated in the conference.

During the conference, all the participants actively showed their insights into the conference themes and freely exchanged their ideas and experiences. After the conference, they also joined the interesting tourism well-prepared by the Organizing Committee. Hereby, we extend our sincere gratitude to all the scholars and researchers for their attendance and great support to this conference. MSCIENG2019 will be held in Nanjing, China in 2019. Welcome your participation.

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